US 12,136,757 B2
MMIC device on a substrate and mounted within a waveguide block, wherein a metal foil layer extends from the substrate to form in part a through hole
Byron Alderman, Didcot (GB); and Jeffrey Powell, Didcot (GB)
Assigned to Teratech Components Limited, Didcot (GB)
Appl. No. 17/769,755
Filed by TERATECH COMPONENTS LIMITED, Didcot (GB)
PCT Filed Oct. 16, 2020, PCT No. PCT/GB2020/052614
§ 371(c)(1), (2) Date Apr. 17, 2022,
PCT Pub. No. WO2021/074642, PCT Pub. Date Apr. 22, 2021.
Claims priority of application No. 1915109 (GB), filed on Oct. 18, 2019.
Prior Publication US 2022/0376375 A1, Nov. 24, 2022
Int. Cl. H01P 3/12 (2006.01); H01P 5/107 (2006.01)
CPC H01P 3/12 (2013.01) [H01P 5/107 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a waveguide block defining a cavity therein; and
a monolithic microwave or millimetre-wave integrated circuit device positioned at least partially in the cavity,
wherein:
the monolithic microwave or millimetre-wave integrated circuit device comprises a dielectric substrate and a metal foil layer that extends outwards from an external edge of the dielectric substrate;
the metal foil layer and the dielectric substrate define a through hole, wherein a first edge of the through hole is an edge of the metal foil layer, and wherein the first edge of the through hole forms an end of an elongate waveguide channel within the cavity; and
the metal foil layer at least partly determines both a length and a width of the elongate waveguide channel.