US 12,136,684 B2
Method for manufacturing light emitting apparatus, light emitting apparatus, and projector
Takashi Miyata, Shiojiri (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on Nov. 29, 2021, as Appl. No. 17/536,139.
Claims priority of application No. 2020-198137 (JP), filed on Nov. 30, 2020.
Prior Publication US 2022/0173266 A1, Jun. 2, 2022
Int. Cl. H01L 33/04 (2010.01); G03B 21/20 (2006.01); H01L 33/00 (2010.01)
CPC H01L 33/005 (2013.01) [G03B 21/2006 (2013.01); H01L 33/04 (2013.01); H01L 2933/0083 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A light emitting apparatus comprising:
a substrate having a first region, a second region, and a third region, the first region and the second region being laterally located next to each other in a cross section, the second region and the third region being laterally located next to each other in the cross section, the first region being laterally sandwiched between the second region and the third region in the cross section;
a light emitting section that is provided on the substrate and includes a plurality of columnar sections, the plurality of columnar sections being provided only on the first region of the substrate, each of the plurality of columnar sections including a light emitting layer;
a protrusion-shaped section that is respectively provided only on the second region and the third region of the substrate and contains a same substance as the light emitting section;
a first insulating layer provided on the substrate including the first, second, and third regions so as to cover the light emitting section and the protrusion-shaped section; and
a second insulating layer provided on the first insulating layer,
wherein the protrusion-shaped section protrudes from the substrate into the first insulating layer but does not protrude into the second insulating layer beyond a first upper surface of the first insulating layer, and
the protrusion-shaped section penetrates into an inside of the first insulating layer.