US 12,136,623 B2
Multi-device semiconductor chip with electrical access to devices at either side
Edward Fuergut, Dasing (DE); Peter Friedrichs, Nuremberg (DE); Ralf Otremba, Kaufbeuren (DE); and Hans-Joachim Schulze, Taufkirchen (DE)
Assigned to Infineon Technologies Austria AG, Villach (AT)
Filed by Infineon Technologies Austria AG, Villach (AT)
Filed on Nov. 11, 2020, as Appl. No. 17/095,389.
Prior Publication US 2022/0149038 A1, May 12, 2022
Int. Cl. H01L 27/06 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 29/16 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01)
CPC H01L 27/0635 (2013.01) [H01L 23/31 (2013.01); H01L 23/5386 (2013.01); H01L 24/09 (2013.01); H01L 29/1608 (2013.01); H01L 29/7393 (2013.01); H01L 29/78 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a semiconductor chip that comprises a semiconductor body comprising a main surface and a rear surface opposite the main surface;
first and second switching devices that are each monolithically integrated in the semiconductor body;
an electrically insulating encapsulant body that encapsulates the semiconductor chip;
a first package contact that is electrically connected to the first switching device by a first bond pad that is disposed on the main surface; and
a second package contact that is electrically connected to the second switching device by a second bond pad that is disposed on the rear surface.