US 12,136,620 B2
Optical systems fabricated by printing-based assembly
John A. Rogers, Wilmette, IL (US); Ralph Nuzzo, Champaign, IL (US); Matthew Meitl, Durham, NC (US); Etienne Menard, Durham, NC (US); Alfred Baca, Urbana, IL (US); Michael Motala, Champaign, IL (US); Jong-Hyun Ahn, Suwon (KR); Sang-Il Park, Savoy, IL (US); Chang-Jae Yu, Urbana, IL (US); Heung Cho Ko, Gwangju (KR); Mark Stoykovich, Dover, NH (US); and Jongseung Yoon, Urbana, IL (US)
Assigned to The Board of Trustees of the University of Illinois, Urbana, IL (US); and X-Celeprint Limited, Cork (IE)
Filed by The Board of Trustees of the University of Illinois, Urbana, IL (US); and X-CELEPRINT LIMITED, Cork (IE)
Filed on Mar. 9, 2022, as Appl. No. 17/690,952.
Application 17/690,952 is a continuation of application No. 16/667,215, filed on Oct. 29, 2019, granted, now 11,309,305.
Application 16/667,215 is a continuation of application No. 15/402,723, filed on Jan. 10, 2017, granted, now 10,504,882, issued on Dec. 10, 2019.
Application 15/402,723 is a continuation of application No. 14/800,363, filed on Jul. 15, 2015, granted, now 9,601,671, issued on Mar. 21, 2017.
Application 14/800,363 is a continuation of application No. 14/209,481, filed on Mar. 13, 2014, granted, now 9,117,940, issued on Aug. 25, 2015.
Application 14/209,481 is a continuation of application No. 13/100,774, filed on May 4, 2011, granted, now 8,722,458, issued on May 13, 2014.
Application 13/100,774 is a continuation of application No. 11/981,380, filed on Oct. 31, 2007, granted, now 7,972,875, issued on Jul. 5, 2011.
Claims priority of provisional application 60/944,611, filed on Jun. 18, 2007.
Claims priority of provisional application 60/885,306, filed on Jan. 17, 2007.
Prior Publication US 2022/0199606 A1, Jun. 23, 2022
Int. Cl. H01L 25/00 (2006.01); H01L 21/00 (2006.01); H01L 25/04 (2023.01); H01L 25/075 (2006.01); H01L 25/16 (2023.01); H01L 27/12 (2006.01); H01L 27/146 (2006.01); H01L 31/02 (2006.01); H01L 31/0216 (2014.01); H01L 31/0232 (2014.01); H01L 31/0288 (2006.01); H01L 31/0304 (2006.01); H01L 31/043 (2014.01); H01L 31/0525 (2014.01); H01L 31/054 (2014.01); H01L 31/0693 (2012.01); H01L 31/0725 (2012.01); H01L 31/167 (2006.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 33/06 (2010.01); H01L 33/30 (2010.01); H01L 33/48 (2010.01); H01L 33/52 (2010.01); H01L 33/54 (2010.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01S 5/02 (2006.01); H01S 5/02251 (2021.01); H01S 5/183 (2006.01); H01S 5/30 (2006.01); H01S 5/343 (2006.01); H01S 5/42 (2006.01); B82Y 10/00 (2011.01); H01L 29/786 (2006.01)
CPC H01L 25/50 (2013.01) [H01L 21/00 (2013.01); H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 27/1214 (2013.01); H01L 27/124 (2013.01); H01L 27/1285 (2013.01); H01L 27/1292 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01); H01L 27/14643 (2013.01); H01L 31/02005 (2013.01); H01L 31/02008 (2013.01); H01L 31/02168 (2013.01); H01L 31/02325 (2013.01); H01L 31/02327 (2013.01); H01L 31/0288 (2013.01); H01L 31/03046 (2013.01); H01L 31/043 (2014.12); H01L 31/0525 (2013.01); H01L 31/0543 (2014.12); H01L 31/0547 (2014.12); H01L 31/0693 (2013.01); H01L 31/0725 (2013.01); H01L 31/167 (2013.01); H01L 31/1804 (2013.01); H01L 31/1824 (2013.01); H01L 31/1868 (2013.01); H01L 31/1876 (2013.01); H01L 31/1892 (2013.01); H01L 33/005 (2013.01); H01L 33/0093 (2020.05); H01L 33/06 (2013.01); H01L 33/30 (2013.01); H01L 33/483 (2013.01); H01L 33/52 (2013.01); H01L 33/54 (2013.01); H01L 33/56 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01S 5/021 (2013.01); H01S 5/02251 (2021.01); H01S 5/183 (2013.01); H01S 5/3013 (2013.01); H01S 5/34326 (2013.01); H01S 5/423 (2013.01); B81C 2201/0185 (2013.01); B82Y 10/00 (2013.01); H01L 29/78603 (2013.01); H01L 29/78681 (2013.01); H01L 2924/0002 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0091 (2013.01); Y02E 10/52 (2013.01); Y02E 10/547 (2013.01); Y02P 70/50 (2015.11)] 17 Claims
OG exemplary drawing
 
1. A display system comprising:
a device substrate;
a plurality of semiconductor elements disposed directly on a surface of the device substrate, wherein each semiconductor element of the plurality of semiconductor elements has at least a length or a width less than or equal to 200 microns and a thickness less than or equal to 100 microns, wherein the semiconductor elements are printed onto the device substrate from a source wafer, wherein the device substrate comprises a material different from a material of the semiconductor device, and wherein the semiconductor elements comprise an array of micro-transfer-printed inorganic LEDs controlled by transistors and electrically connected with an array of electrodes, gate lines, and data lines disposed on the device substrate.