US 12,136,617 B2
Electrical bridge package with integrated off-bridge photonic channel interface
Ankur Aggarwal, Pleasanton, CA (US)
Assigned to CELESTIAL AI INC., Santa Clara, CA (US)
Filed by Celestial AI Inc., Santa Clara, CA (US)
Filed on Jan. 8, 2024, as Appl. No. 18/407,408.
Application 18/407,408 is a continuation in part of application No. 18/217,898, filed on Jul. 3, 2023.
Application 18/217,898 is a continuation in part of application No. 18/076,196, filed on Dec. 6, 2022.
Application 18/217,898 is a continuation in part of application No. 18/076,210, filed on Dec. 6, 2022.
Claims priority of provisional application 63/437,639, filed on Jan. 6, 2023.
Claims priority of provisional application 63/437,641, filed on Jan. 6, 2023.
Claims priority of provisional application 63/392,475, filed on Jul. 26, 2022.
Prior Publication US 2024/0153934 A1, May 9, 2024
Int. Cl. H01L 25/16 (2023.01); G02B 6/42 (2006.01); H01L 21/56 (2006.01); H01L 23/538 (2006.01)
CPC H01L 25/167 (2013.01) [H01L 21/56 (2013.01); H01L 23/5384 (2013.01); G02B 6/4202 (2013.01); G02B 6/4292 (2013.01)] 29 Claims
OG exemplary drawing
 
1. A method of manufacturing a circuit package, comprising:
connecting an analog-mixed signal portion of a die to a photonic interposer, wherein the analog-mixed signal portion of the die includes a driver and a transimpedance amplifier (TIA), wherein the photonic interposer includes a modulator and a photodetector, and wherein connecting the analog-mixed signal portion of the die includes:
connecting the driver to the modulator via a first electrical interconnect; and
connecting the TIA to the photodetector via a second electrical interconnect, wherein each of the first electrical interconnect and the second electrical interconnect have a length of less than 100 microns;
connecting an electronic portion of the die to the electrical interposer, where the die partially overlaps both the photonic interposer and the electrical interposer; and
connecting an optical element to the photonic interposer.