CPC H01L 25/167 (2013.01) [H01L 24/05 (2013.01); H01L 24/24 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/24146 (2013.01)] | 20 Claims |
1. A light emitting diode (LED) module having a multi-layer structure, the LED module comprising:
a substrate;
a LED on the substrate, the LED configured to emit light toward the substrate;
a plurality of upper electrodes on the LED and connected to the LED;
an upper insulating layer surrounding the plurality of upper electrodes;
a film on glass (FOG) electrode on the upper insulating layer;
a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer;
a metal capping layer provided between the FOG electrode and the fan out interconnection structure; and
a thin film transistor (TFT) provided on the substrate and having a gate electrode,
wherein a length of the FOG electrode extending in a first direction along an upper surface of the upper insulating layer is longer than a width of the FOG electrode extending in a second direction along the upper surface of the upper insulating layer, the second direction being perpendicular to the first direction,
wherein the plurality of upper electrodes comprise a first upper electrode connected to a signal electrode and a second upper electrode connected to the gate electrode, the signal electrode provided to supply a data signal to the LED, and
wherein the FOG electrode connects the first and the second upper electrodes respectively connected to the signal electrode and the gate electrode to be connected to the FOG electrode through the fan out interconnection structure.
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