US 12,136,585 B2
Compact power electronics module with increased cooling surface
Stefan Behrendt, Kiel (DE); and Ronald Eisele, Surendorf (DE)
Assigned to DANFOSS SILICON POWER GMBH, Flensburg (DE)
Appl. No. 17/607,942
Filed by Danfoss Silicon Power GmbH, Flensburg (DE)
PCT Filed Apr. 30, 2020, PCT No. PCT/EP2020/062036
§ 371(c)(1), (2) Date Nov. 1, 2021,
PCT Pub. No. WO2020/221862, PCT Pub. Date Nov. 5, 2020.
Claims priority of application No. 102019111366.0 (DE), filed on May 2, 2019.
Prior Publication US 2022/0293489 A1, Sep. 15, 2022
Int. Cl. H01L 23/473 (2006.01)
CPC H01L 23/473 (2013.01) 20 Claims
OG exemplary drawing
 
1. A power electronics module comprising a first circuit carrier, as well as a first electronic assembly arranged in an electrically contacting manner on the upper flat side of the first circuit carrier, and a first cooling element in thermal contact with the underside of the first circuit carrier, wherein the module has at least one second electronic assembly arranged on the upper side of a second circuit carrier and a second cooling element arranged on the underside of the second circuit carrier, wherein the first and the second circuit carriers are arranged with their upper sides facing one another and at least one central heat sink that is electrically insulated from the electronic assemblies is arranged in the space between the electronic assemblies, wherein the electronic assemblies and the at least one central heat sink are embedded in a heat-conducting potting compound, wherein the module has a number N≥3 of circuit carriers with electronic assemblies mounted on their upper sides and cooling elements mounted on their undersides, and the sides having the electronic assemblies and directed towards one another are arranged around the central heat sink forming a shape with an N-sided polygon as a cross-section.