US 12,136,581 B2
Semiconductor package structure and fabrication method thereof
Youngho Kim, Seoul (KR); and Hwanpil Park, Hwaseong-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Nov. 10, 2023, as Appl. No. 18/506,742.
Application 18/506,742 is a continuation of application No. 17/700,956, filed on Mar. 22, 2022, granted, now 11,842,941.
Application 17/700,956 is a continuation of application No. 17/078,422, filed on Oct. 23, 2020, granted, now 11,315,851, issued on Apr. 26, 2022.
Application 17/078,422 is a continuation of application No. 15/754,520, granted, now 10,847,435, issued on Nov. 24, 2020, previously published as PCT/KR2016/009634, filed on Aug. 30, 2016.
Claims priority of application No. 10-2015-0123166 (KR), filed on Aug. 31, 2015; and application No. 10-2016-0106744 (KR), filed on Aug. 23, 2016.
Prior Publication US 2024/0079288 A1, Mar. 7, 2024
Int. Cl. H01L 23/34 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/492 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01)
CPC H01L 23/367 (2013.01) [H01L 23/3677 (2013.01); H01L 23/3736 (2013.01); H01L 23/3738 (2013.01); H01L 23/40 (2013.01); H01L 23/492 (2013.01); H01L 24/19 (2013.01); H01L 25/105 (2013.01); H01L 23/49816 (2013.01); H01L 23/5389 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/19 (2013.01); H01L 2224/73259 (2013.01); H01L 2924/15153 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A package comprising:
a first package structure comprising:
a first die having a front-side and a back-side;
a second die having a front-side and a back-side, the front-side comprising contact pads, and the back-side comprising a joining pattern and a solder bump joined to the joining pattern on the second die;
a first attaching structure between and contacting the back-side of the second die and the front-side of the first die;
a first connecting plug adjacent the second die, the first attaching structure, and the first die;
an encapsulant laterally encapsulating the second die, the first die, the first attaching structure, and the first connecting plug;
a first re-distribution layer on and electrically connected to the contact pads of the second die and the first connecting plug; and
solder bumps on the back-side of the first die; and
a second package structure bonded to the first connecting plug and the solder bumps with a first set of conductive connectors.