US 12,136,580 B2
Embedding methods for fine-pitch components and corresponding component carriers
Jeesoo Mok, Chongqing (CN); and Artan Baftiri, Chongqing (CN)
Assigned to AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on Mar. 31, 2022, as Appl. No. 17/657,541.
Claims priority of application No. 202110363356.1 (CN), filed on Apr. 2, 2021.
Prior Publication US 2022/0319943 A1, Oct. 6, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H05K 3/34 (2006.01)
CPC H01L 23/315 (2013.01) [H01L 21/4857 (2013.01); H01L 23/5389 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H05K 1/186 (2013.01); H05K 3/3436 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method of manufacturing a component carrier, the method comprising:
embedding a poorly adhesive structure in a stack, wherein the stack comprises at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;
forming a cavity in the stack by removing a stack piece, wherein the stack piece is in part delimited by the poorly adhesive structure; and
selectively exposing a bottom of the cavity by partially removing the poorly adhesive structure.