US 12,136,578 B2
Interlayer of sub-structure having elevations and further sub-structure with filler particles in recesses between the elevations
Stefan Schwab, Regensburg (DE); and Edmund Riedl, Wald (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Apr. 23, 2021, as Appl. No. 17/238,372.
Claims priority of application No. 102020111071.5 (DE), filed on Apr. 23, 2020.
Prior Publication US 2021/0335686 A1, Oct. 28, 2021
Int. Cl. H01L 23/31 (2006.01); H01L 21/54 (2006.01); H01L 21/56 (2006.01); H01L 23/42 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/3142 (2013.01) [H01L 21/54 (2013.01); H01L 21/565 (2013.01); H01L 23/42 (2013.01); H01L 23/49575 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A structure, comprising:
a first sub-structure; and
a second sub-structure coupled with the first sub-structure and being a composite comprising filler particles in a matrix,
wherein a surface of the first sub-structure has a surface profile with first elevations and first recesses configured to enable at least part of the filler particles to at least partially enter the first recesses to thereby form an interlayer comprising the first elevations of the first sub-structure and filler particles in the matrix of the second sub-structure,
wherein the surface of the first sub-structure has second elevations and second recesses formed on the first elevations and the first recesses,
wherein the second recesses are dimensioned to enable at least part of the matrix to at least partially enter the second recesses and are dimensioned to disable the filler particles to enter the second recesses.