US 12,136,577 B2
Integrated circuit die packages including a contiguous heat spreader
Feras Eid, Chandler, AZ (US); Joe Walczyk, Tigard, OR (US); and Paul Diglio, Gaston, OR (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Jun. 25, 2020, as Appl. No. 16/911,820.
Prior Publication US 2021/0407877 A1, Dec. 30, 2021
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2023.01); H01L 25/07 (2006.01); H01L 25/075 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/3135 (2013.01) [H01L 21/56 (2013.01); H01L 23/3107 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 25/0753 (2013.01); H01L 25/18 (2013.01); H01L 2924/181 (2013.01)] 22 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) die package, comprising:
a package substrate;
an IC die having a first surface coupled to a first region of the package substrate; and
a heat spreader material contiguous with a second surface of the IC die, opposite the first surface, wherein the heat spreader material extends beyond an edge of the IC die over a second region of the package substrate and wherein the heat spreader material is a solid with a void area percentage of at least 0.1%.