US 12,136,576 B1
Microelectronic module
Peter C. Salmon, Mountain View, CA (US)
Filed by Peter C. Salmon, Mountain View, CA (US)
Filed on Mar. 18, 2024, as Appl. No. 18/607,807.
Claims priority of provisional application 63/522,540, filed on Jun. 22, 2023.
Int. Cl. H05K 7/20 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/44 (2006.01); H01L 23/29 (2006.01)
CPC H01L 23/3121 (2013.01) [H01L 21/56 (2013.01); H01L 23/44 (2013.01); H05K 7/20772 (2013.01); H01L 23/29 (2013.01); H01L 23/291 (2013.01); H01L 23/293 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A microelectronic module comprising:
a substrate;
thin film conductors formed on the substrate, wherein selected ones of the thin film conductors have a half-pitch in the range of 50 nm-2 μm;
a plurality of electronic components mounted on the substrate; and,
a water impermeable coating that covers the substrate and the plurality of electronic components.