US 12,136,563 B2
Semiconductor manufacturing apparatus including bonding head
Mingu Lee, Cheonan-si (KR); Chulhyun Park, Anyang-si (KR); Kangsan Lee, Hwaseong-si (KR); Eunhaeng Lee, Suwon-si (KR); and Euisun Choi, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on May 10, 2021, as Appl. No. 17/315,604.
Claims priority of application No. 10-2020-0125090 (KR), filed on Sep. 25, 2020.
Prior Publication US 2022/0102185 A1, Mar. 31, 2022
Int. Cl. H01L 21/683 (2006.01); H01L 21/677 (2006.01); H01L 21/68 (2006.01)
CPC H01L 21/6838 (2013.01) [H01L 21/67796 (2013.01); H01L 21/681 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor manufacturing apparatus configured to bond a substrate to a semiconductor chip, the semiconductor manufacturing apparatus comprising:
a support configured to mount the substrate on a main surface of the support; and
a bonding head configured to transfer the semiconductor chip to stack the semiconductor chip on the substrate and comprising an attachment pad configured to attach to the semiconductor chip, wherein the attachment pad comprises:
a bottom surface configured to attach to the semiconductor chip;
a vacuum channel extending from the bottom surface; and
a cavity, and
wherein the bonding head is configured to adjust a shape of the bottom surface of the attachment pad by adjusting a pressure of air in the cavity.