US 12,136,561 B2
Substrate transfer device
Sanglyong Shin, Cheonan-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Apr. 7, 2022, as Appl. No. 17/715,782.
Claims priority of application No. 10-2021-0132410 (KR), filed on Oct. 6, 2021.
Prior Publication US 2023/0108525 A1, Apr. 6, 2023
Int. Cl. H01L 21/677 (2006.01)
CPC H01L 21/67766 (2013.01) [H01L 21/67733 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate transfer device, comprising:
a housing having a surface that has an opening through which a substrate is introduced; and
a substrate hold structure that fixes the substrate in the housing,
wherein the substrate hold structure includes:
a lower support that extends onto a bottom surface of the substrate from one of inner surfaces of the housing, the lower support including a first hold member beneath the substrate; and
an upper support that extends toward a side of the substrate from one of the inner surfaces of the housing, the upper support including a second hold member,
wherein an operation of the upper support causes the second hold member to move onto the substrate such that the second hold member contacts a top surface of the substrate and overlaps the first hold member with the substrate between the second hold member and the first hold member, and
wherein an extension part of the upper support penetrates the housing and protrudes onto an outer surface of the housing.