US 12,136,547 B1
System and method for improving the release of chips in the laser perforation of thin films
Robert Jian Zhang, Brighton, NY (US); George Leonidas Vassilaros, Rochester, NY (US); Michael Stephen Roetker, Webster, NY (US); and Scott Joseph Griffin, Fairport, NY (US)
Assigned to XEROX CORPORATION, Norwalk, CT (US)
Filed by Xerox Corporation, Norwalk, CT (US)
Filed on Jul. 22, 2021, as Appl. No. 17/382,463.
Int. Cl. H01L 21/02 (2006.01); B23K 26/382 (2014.01)
CPC H01L 21/02675 (2013.01) [B23K 26/382 (2015.10)] 13 Claims
OG exemplary drawing
 
1. A laser perforation system, comprising:
a drive roller;
a tensioner roller spaced apart from the drive roller;
a thin film belt arranged around both the drive roller and tensioner roller, the thin film belt including a front surface facing radially outward and a rear surface facing radially inward;
a backstop arranged proximate the rear surface of the thin film belt; and,
a laser head arranged proximate the front surface, the laser head operatively arranged to direct a laser at the thin film belt to create holes therein.