US 12,136,540 B2
Substrate processing device and method for manufacturing same
Young Gon Kim, Hwaseong-si (KR); Jong Woo Lim, Suwon-si (KR); Nam Hui Lee, Osan-si (KR); Min Choul Hyun, Gumi-si (KR); Dongwook Kim, Paju-si (KR); and Jewook Kim, Paju-si (KR)
Assigned to LG DISPLAY CO., LTD., Seoul (KR); and ELECTRO STATIC TECHNOLOGY, INC., Osan-si (KR)
Filed by LG DISPLAY CO., LTD., Seoul (KR); and ELECTRO STATIC TECHNOLOGY, INC., Osan-si (KR)
Filed on Dec. 14, 2023, as Appl. No. 18/540,331.
Claims priority of application No. 10-2022-0134659 (KR), filed on Oct. 19, 2022.
Prior Publication US 2024/0136162 A1, Apr. 25, 2024
Prior Publication US 2024/0234109 A9, Jul. 11, 2024
Int. Cl. B23P 19/04 (2006.01); C23C 14/30 (2006.01); C23C 14/50 (2006.01); C23C 14/54 (2006.01); H01J 37/32 (2006.01); H05K 13/04 (2006.01); H10K 71/16 (2023.01)
CPC H01J 37/32724 (2013.01) [C23C 14/30 (2013.01); C23C 14/50 (2013.01); C23C 14/541 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/3323 (2013.01); H10K 71/166 (2023.02)] 24 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a titanium cooling plate having an upper surface and a lower surface opposite to the upper surface;
an electrostatic chuck including a first dielectric layer provided on the lower surface of the titanium cooling plate, an electrode layer provided on the first dielectric layer, and a second dielectric layer provided on the first dielectric layer and the electrode layer, wherein the electrostatic chuck is configured to chuck a glass substrate supplied from below using an electrostatic force; and
a yoke plate positioned on the upper surface of the titanium cooling plate, wherein the yoke plate is configured to chuck a mask supplied from below the glass substrate using a magnetic force,
wherein the titanium cooling plate further includes:
a first channel provided from the upper surface toward the lower surface and having a first width;
a second channel provided from the first channel toward the lower surface and having a second width smaller than the first width; and
a titanium cover plate coupled to the first channel, and
wherein the titanium cooling plate provides a cooling flow path using the second channel, and the cooling flow path is configured to allow a cooling medium to flow.