US 12,136,522 B2
Multilayer broadband ceramic capacitor with internal air gap capacitance
Hung Van Trinh, La Jolla, CA (US); Alan Devoe, La Jolla, CA (US); and Lambert Devoe, San Diego, CA (US)
Assigned to Presidio Components. Inc., San Diego, CA (US)
Filed by Presidio Components. Inc., San Diego, CA (US)
Filed on Aug. 8, 2022, as Appl. No. 17/818,205.
Application 17/818,205 is a division of application No. 16/156,708, filed on Oct. 10, 2018, granted, now 11,443,898.
Application 16/156,708 is a continuation in part of application No. 15/942,987, filed on Apr. 2, 2018, abandoned.
Claims priority of provisional application 62/483,794, filed on Apr. 10, 2017.
Prior Publication US 2022/0384115 A1, Dec. 1, 2022
Int. Cl. H01G 4/30 (2006.01); H01G 4/012 (2006.01); H01G 4/12 (2006.01); H01G 4/35 (2006.01); H01L 49/02 (2006.01)
CPC H01G 4/30 (2013.01) [H01G 4/012 (2013.01); H01G 4/12 (2013.01); H01G 4/35 (2013.01); H01L 28/40 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A ceramic capacitor comprising:
a plurality of dielectric layers and a plurality of conductive layers sintered together to form a substantially monolithic ceramic body, the body defining at least one void between the dielectric and conductive layers, the void being wholly enclosed within the ceramic body and bounded by at least a portion of a dielectric layer, a first conductive layer, a second conductive layer, and a third conductive layer, the first and second conductive layers having no conductive connection therebetween and the third conductive layer being conductively connected to the first conductive layer.