US 12,136,518 B2
Multilayer electronic component including cover layer having insulating and conductive portions
Do Young Jeong, Suwon-si (KR); Jin Mo Ahn, Suwon-si (KR); and Ji Hong Jo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on Nov. 7, 2022, as Appl. No. 17/981,851.
Claims priority of application No. 10-2021-0194175 (KR), filed on Dec. 31, 2021.
Prior Publication US 2023/0215627 A1, Jul. 6, 2023
Int. Cl. H01G 4/224 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01)
CPC H01G 4/224 (2013.01) [H01G 4/232 (2013.01); H01G 4/2325 (2013.01); H01G 4/30 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A multilayer electronic component comprising:
a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion onto a portion of the first surface;
a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion onto a portion of the first surface; and
a cover layer disposed on the first surface and extending onto the first and second band portions,
wherein the first and second external electrodes include an electrode layer disposed on the body and a plating layer disposed on the electrode layer,
wherein the cover layer includes an insulating portion disposed between the first external electrode and the second external electrode and including an insulating material, a first conductive portion directly connected to the insulating portion and disposed on the plating layer of the first band portion, and a second conductive portion directly connected to the insulating portion and disposed on the plating layer of the second band portion, and
wherein the first and second conductive portions include a conductive metal and a resin.