US 12,136,509 B2
MEMS solenoid inductor and manufacturing method thereof
Tiantong Xu, Haidian District (CN); Zhi Tao, Haidian District Beijing (CN); Haiwang Li, Haidian District (CN); Jiamian Sun, Haidian District (CN); Hanxiao Wu, Haidian District (CN); Kaiyun Zhu, Haidian District (CN); Yanxin Zhai, Haidian District (CN); Xiaoda Cao, Haidian District (CN); Wenbin Wang, Haidian District (CN); and Weidong Fang, Haidian District (CN)
Assigned to BEIHANG UNIVERSITY, Beijing (CN)
Appl. No. 17/290,553
Filed by BEIHANG UNIVERSITY, Haidian District (CN)
PCT Filed Jul. 8, 2019, PCT No. PCT/CN2019/095062
§ 371(c)(1), (2) Date Apr. 30, 2021,
PCT Pub. No. WO2020/087972, PCT Pub. Date May 7, 2020.
Claims priority of application No. 201811277260.8 (CN), filed on Oct. 30, 2018; and application No. 201811509400.X (CN), filed on Dec. 11, 2018.
Prior Publication US 2022/0013275 A1, Jan. 13, 2022
Int. Cl. H01F 27/245 (2006.01); H01F 27/28 (2006.01)
CPC H01F 27/245 (2013.01) [H01F 27/2895 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A MEMS linear solenoid inductor, comprising:
a silicon substrate,
a soft magnetic core, and
a solenoid;
wherein the soft magnetic core is wrapped inside the silicon substrate, the silicon substrate is provided with a spiral channel, the soft magnetic core passes through a center of the spiral channel, and the solenoid is disposed in the spiral channel;
wherein the silicon substrate comprises an upper silicon substrate and a lower silicon substrate, the soft magnetic core comprises an upper core and a lower core, and the upper core has the same shape as the lower core;
wherein the upper silicon substrate is provided with a core slot on a lower surface thereof corresponding to a shape of the upper core, and the lower silicon substrate is provided with a core slot on an upper surface thereof corresponding to the shape of the lower core; and
wherein the upper core and the lower core are disposed in the corresponding core slots, respectively, and the lower surface of the upper silicon substrate and the upper surface of the lower silicon substrate are bonded to each other, so that a lower surface of the upper core and an upper surface of the lower core are aligned with each other.