US 12,135,853 B2
Ultrasonic touch sensor
Klaus Elian, Alteglofsheim (DE); and Horst Theuss, Wenzenbach (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Aug. 30, 2022, as Appl. No. 17/823,372.
Claims priority of application No. 102021122461.6 (DE), filed on Aug. 31, 2021; and application No. 102022121884.8 (DE), filed on Aug. 30, 2022.
Prior Publication US 2023/0063120 A1, Mar. 2, 2023
Int. Cl. G06F 3/043 (2006.01); B06B 1/02 (2006.01)
CPC G06F 3/0436 (2013.01) [B06B 1/0292 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An ultrasonic touch sensor comprising:
a contact surface for attaching the ultrasonic touch sensor to a casing,
a first ultrasonic transducer element,
a first semiconductor chip, wherein the first semiconductor chip comprises the first ultrasonic transducer element,
wherein the first semiconductor chip is potted into a potting compound in to form a first cutout from the first ultrasonic transducer element to the contact surface of the ultrasonic touch sensor, and
wherein the potting compound forms a housing of the ultrasonic touch sensor.