CPC G06F 13/4045 (2013.01) [G06F 13/385 (2013.01); G06F 13/42 (2013.01); G06F 13/4291 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H03K 19/1736 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/1431 (2013.01); H04W 56/0015 (2013.01)] | 20 Claims |
1. An integrated circuit device comprising:
a substrate;
a first die mounted on the substrate, the first die comprising a first plurality of input/output (IO) interfaces;
a plurality of second dies mounted on the substrate, wherein at least one die of the plurality of second dies comprises including an IO interface of a second plurality of IO interfaces;
a plurality of chip-to-chip interconnects formed within the substrate to couple the first plurality of IO interfaces to the second plurality of IO interfaces; and
a management subsystem configurable to utilize the plurality of chip-to-chip interconnects to communicate status and control information between the first die and the plurality of second dies.
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