US 12,135,592 B2
Printed circuits with embedded resistive thermal devices
Anne M. Mason, Palo Alto, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Sep. 25, 2023, as Appl. No. 18/473,567.
Application 18/473,567 is a continuation of application No. 17/224,891, filed on Apr. 7, 2021, granted, now 11,971,760.
Prior Publication US 2024/0012458 A1, Jan. 11, 2024
Int. Cl. G06F 1/20 (2006.01); G01K 3/00 (2006.01); G01K 7/16 (2006.01); G01L 1/22 (2006.01); G06F 1/18 (2006.01); G06F 1/32 (2019.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01)
CPC G06F 1/206 (2013.01) [G01K 3/005 (2013.01); G01K 7/16 (2013.01); G01L 1/22 (2013.01); G06F 1/181 (2013.01); G06F 1/32 (2013.01); H05K 1/0353 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 1/185 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/10151 (2013.01)] 20 Claims
OG exemplary drawing
 
8. An electronic device comprising:
a printed circuit board;
an electrical component surface-mounted to the printed circuit board; and
a resistive thermal device (RTD) that is laminated within the printed circuit board.