US 12,135,590 B2
Electronic device comprising sensor module
Byungseon Hwang, Suwon-si (KR); Deokhee Lee, Suwon-si (KR); and Sunggyu Lee, Suwon-si (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Nov. 8, 2021, as Appl. No. 17/521,186.
Application 17/521,186 is a continuation of application No. PCT/KR2020/005784, filed on Apr. 29, 2020.
Claims priority of application No. 10-2019-0055914 (KR), filed on May 13, 2019.
Prior Publication US 2022/0057846 A1, Feb. 24, 2022
Int. Cl. G06F 1/16 (2006.01); G06V 40/13 (2022.01)
CPC G06F 1/1684 (2013.01) [G06F 1/1616 (2013.01); G06F 1/1652 (2013.01); G06F 1/1656 (2013.01); G06F 1/1681 (2013.01); G06V 40/13 (2022.01)] 16 Claims
OG exemplary drawing
 
1. An electronic device comprising:
a housing; and
sensor circuitry disposed in at least a portion of the housing,
wherein the sensor circuitry comprises:
a fingerprint recognition sensor;
a protection layer enclosing the fingerprint recognition sensor;
an adhesive member disposed on the protection layer; and
a ceramic layer disposed on the adhesive member, and
wherein a periphery of the ceramic layer, a periphery of the adhesive member, and a periphery of one portion of the protection layer comprise a processed surface having a designated slope with respect to one surface of the ceramic layer, and
wherein the periphery of the ceramic layer, the periphery of the adhesive member, and the periphery of the one portion of the protection layer are coplanar along the designated slope and form an external surface of the sensor circuitry.