US 12,135,569 B2
Methods and apparatus to reduce thermal fluctuations in semiconductor processors
Rodrigo De Oliveira Vivi, Hillsboro, OR (US); John Kelbert, Aptos, CA (US); David Lombard, Rossmoor, CA (US); Eric Moret, Beaverton, OR (US); Mark Luckeroth, Portland, OR (US); Brad Bittel, Beaverton, OR (US); and Phani Kumar Kandula, Bangalore (IN)
Assigned to INTEL CORPORATION, Santa Clara, CA (US)
Filed by Intel Corporation, Santa Clara, CA (US)
Filed on Dec. 23, 2020, as Appl. No. 17/133,279.
Prior Publication US 2021/0223805 A1, Jul. 22, 2021
Int. Cl. G05D 23/19 (2006.01); G05B 15/02 (2006.01); G06F 9/48 (2006.01); G06F 9/50 (2006.01)
CPC G05D 23/1917 (2013.01) [G05B 15/02 (2013.01); G06F 9/4893 (2013.01); G06F 9/5094 (2013.01)] 25 Claims
OG exemplary drawing
 
1. An apparatus comprising:
memory;
instructions; and
programmable circuitry to execute the instructions to:
determine a current temperature of a processor; and
provide, in response to the current temperature falling below a setback temperature, an idle workload to the processor for execution, execution of the idle workload to cause the processor to heat up to maintain the processor above a threshold temperature, the setback temperature a fixed temperature delta higher than the threshold temperature.