US 12,135,500 B2
Stamp and method for embossing
Markus Wimplinger, Reid am Innkreis (AT); and Gerald Mittendorfer, Stuben (AT)
Assigned to EV Group E. Thallner GmbH, St. Florian am Inn (AT)
Appl. No. 17/051,312
Filed by EV Group E. Thallner GmbH, St. Florian am Inn (AT)
PCT Filed May 4, 2018, PCT No. PCT/EP2018/061584
§ 371(c)(1), (2) Date Oct. 28, 2020,
PCT Pub. No. WO2019/210976, PCT Pub. Date Nov. 7, 2019.
Prior Publication US 2021/0240075 A1, Aug. 5, 2021
Int. Cl. G03F 7/00 (2006.01); B29C 59/00 (2006.01); B29C 59/02 (2006.01)
CPC G03F 7/0002 (2013.01) [B29C 59/002 (2013.01); B29C 59/022 (2013.01); B29C 59/026 (2013.01); G03F 7/70875 (2013.01); B29C 2059/023 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A stamp comprising:
a soft stamp; and
a deformable carrier on which the soft stamp is detachably embossed and from which the soft stamp is removable via plasma removal, the carrier comprising at least one heating element, the carrier being composed of a semiconductor material and constituted as a plate having a thickness in a range of 0.1 mm and 10 mm.