US 12,135,499 B2
Reticle enclosure for lithography systems
Pei-Cheng Hsu, Taipei (TW); Ta-Cheng Lien, Cyonglin Township (TW); and Hsin-Chang Lee, Zhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed on Aug. 30, 2021, as Appl. No. 17/461,392.
Prior Publication US 2023/0066653 A1, Mar. 2, 2023
Int. Cl. G03F 1/22 (2012.01); G03F 1/66 (2012.01); G03F 7/00 (2006.01)
CPC G03F 1/66 (2013.01) [G03F 1/22 (2013.01); G03F 7/70033 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A reticle enclosure, comprising:
an outer pod encasing an inner pod,
wherein each of the outer pod and inner pod comprises:
a base including a first surface;
a cover including a second surface and disposed on the base,
wherein the base and the cover of the inner pod form an internal space therebetween to include a reticle,
each cover includes a top portion and a side portion extending vertically from the top portion around a periphery of the top portion,
the top portion and the side portion of the inner pod form a unitary structure made of a first protective material,
the top portion and the side portion of the outer pod form a unitary structure made of a second protective material;
a first layer of elastomer or gelatinous material disposed on an entire width of the first surface of the inner pod and a second layer of elastomer or gelatinous material disposed on an entire width of the second surface of the inner pod, such that the first and second layers interleave/interlock with each other when the first and second surfaces are mated; and
a third layer of elastomer or gelatinous material disposed on the first surface and the second surface of the outer pod.