CPC G02B 6/4206 (2013.01) [G02B 6/30 (2013.01); G02B 6/4214 (2013.01)] | 20 Claims |
1. A silicon photonic (SiP) chip configured for backside or frontside optical fiber coupling, the SiP chip comprising:
a photonic integrated circuit formed on a first surface of a first substrate, the photonic integrated circuit comprising at least one optical component and at least one corresponding coupling element, wherein the at least one optical component comprises at least one waveguide extending substantially parallel to the first surface;
at least one cavity formed through a second surface of the first substrate, the at least one cavity aligned with the at least one corresponding coupling element, wherein the second surface of the first substrate is opposite the first surface of the first substrate, wherein the at least one cavity is a cavity array comprising a plurality of cavities, each cavity of the plurality of cavities aligned with a respective coupling element of the at least one corresponding coupling element; and
at least one optical fiber secured within the at least one cavity such that the at least one optical fiber is optically coupled to the at least one optical component by the at least one corresponding coupling element, wherein the at least one optical fiber is a first plurality of optical fibers and each optical fiber of the first plurality of optical fibers is secured within a respective one of the plurality of cavities and optically coupled to a respective optical component of the at least one optical component by the respective coupling element, and wherein each optical fiber of the first plurality of optical fibers is mechanically secured to a first fiber block.
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