US 12,135,454 B2
Structure and process for photonic packages
Chen-Hua Yu, Hsinchu (TW); Hsing-Kuo Hsia, Jhubei (TW); and Kuo-Chiang Ting, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Apr. 16, 2021, as Appl. No. 17/232,567.
Prior Publication US 2022/0334310 A1, Oct. 20, 2022
Int. Cl. G02B 6/122 (2006.01); G02B 6/12 (2006.01)
CPC G02B 6/1225 (2013.01) [G02B 6/12019 (2013.01); G02B 2006/1213 (2013.01); G02B 2006/12173 (2013.01); G02B 2006/12176 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a first layer between a second layer and a semiconductor substrate, the first layer being between the semiconductor substrate and the second layer, the first layer having a first surface facing the semiconductor substrate and a second surface facing the second layer;
forming a first waveguide in the second layer;
forming a photonic die over the first waveguide;
after providing the first layer, the second layer and the semiconductor substrate, forming a first cavity in the semiconductor substrate and exposing a portion of the first surface of the first layer to form an exposed first surface of the first surface of the first layer;
filling the first cavity with a first backfill material on the exposed first surface of the first layer; and
electrically coupling an electronic die to the photonic die.