US 12,135,348 B2
Substrate testing with three-dimensional scanning
Barak Freedman, Binyamina (IL); and Amir Silber, Rehovot (IL)
Assigned to Mellanox Technologies, Ltd., Yokneam (IL)
Filed by Mellanox Technologies, Ltd., Yokneam Illit (IL)
Filed on Aug. 24, 2022, as Appl. No. 17/894,871.
Claims priority of provisional application 63/319,240, filed on Mar. 11, 2022.
Prior Publication US 2023/0288472 A1, Sep. 14, 2023
Int. Cl. G01R 31/28 (2006.01); G01B 11/24 (2006.01); G01N 21/95 (2006.01); G06T 7/00 (2017.01); G06T 7/62 (2017.01)
CPC G01R 31/2886 (2013.01) [G01B 11/24 (2013.01); G01N 21/9501 (2013.01); G06T 7/0004 (2013.01); G06T 7/62 (2017.01); G06T 2200/04 (2013.01); G06T 2207/30148 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate testing device comprising:
a first testing component configured to couple to electrical pads of a substrate and perform electrical testing on one or more dies of the substrate during a test;
a second testing component configured to perform optical testing of the one or more dies during the test; and
a third testing component comprising a three-dimensional scanner configured to perform one or more three-dimensional scans of the one or more dies in order to perform geometrical testing on the one or more dies during the test and to perform an alignment of the first testing component and the second testing component with respect to the substrate.