US 12,135,252 B2
Force sensor with conductive films
Hiroumi Kinjo, Tokyo (JP)
Assigned to Japan Display Inc., Tokyo (JP)
Filed by Japan Display Inc., Tokyo (JP)
Filed on Mar. 4, 2022, as Appl. No. 17/686,910.
Application 17/686,910 is a continuation of application No. PCT/JP2020/029521, filed on Jul. 31, 2020.
Claims priority of application No. 2019-172075 (JP), filed on Sep. 20, 2019.
Prior Publication US 2022/0187145 A1, Jun. 16, 2022
Int. Cl. G01L 1/20 (2006.01); G01L 1/14 (2006.01); G01L 1/16 (2006.01)
CPC G01L 1/205 (2013.01) [G01L 1/146 (2013.01); G01L 1/16 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A force sensor comprising:
a sensor sheet having a first surface and a second surface on an opposite side to the first surface;
a substrate facing the first surface;
a first adhesive layer interposed between the substrate and the sensor sheet and made of an anisotropic conductive material; and
a plurality of array electrodes that are separated from each other and interposed between the substrate and the first adhesive layer, wherein
the first surface of the sensor sheet is bonded to the first adhesive layer, and
the first adhesive layer has conductivity in a thickness direction and has insulation properties in a first planar direction along a first plane,
the first adhesive layer has a conducting portion that conducts in the thickness direction and an insulating portion that insulates in the thickness direction,
a plurality of conductive films are interposed between the first adhesive layer and the sensor sheet and are disposed on a surface of the sensor sheet and laterally along the surface of the sensor sheet,
a planar area of each of the conductive films is larger than that of the conducting portion,
an extending direction of the planar area intersects the thickness direction, and
the conductive films increase a part of the sensor sheet that conducts with the conducting portion.