US 12,135,237 B1
Through-beam photoelectric sensor and assembly method
Xiaoyi Zhang, Guangdong (CN); Chaofan Luo, Guangdong (CN); Wenqi Huang, Guangdong (CN); and Wusheng Qu, Guangdong (CN)
Assigned to SHENZHEN HUAYIFENG TECHNOLOGY CO. LTD., Guangdong (CN)
Filed by SHENZHEN HUAYIFENG TECHNOLOGY CO. LTD., Guangdong (CN)
Filed on Jul. 17, 2024, as Appl. No. 18/775,016.
Application 18/775,016 is a continuation of application No. PCT/CN2022/133036, filed on Nov. 19, 2022.
Claims priority of application No. 202210544516.7 (CN), filed on May 19, 2022.
Int. Cl. G01J 1/42 (2006.01)
CPC G01J 1/42 (2013.01) 10 Claims
OG exemplary drawing
 
1. A through-beam photoelectric sensor, comprising an emitter and a receiver, wherein the emitter is opposite the receiver, the receiver is configured to receive an optical signal from the emitter, the emitter comprises a first housing, an emitter lens, a first printed circuit board (PCB), a lamp panel and an emission lamp, the emitter lens is embedded in the first housing, a light hole is formed in the lamp panel, the emission lamp is welded on the lamp panel and clamped in the light hole, a limit block is provided in the first housing, the lamp panel is detachably mounted on the limit block, and the first PCB is in plug-in connection with the limit block and engaged with the lamp panel, such that a wick of the emission lamp is aligned with an optical center of the emitter lens.