US 12,135,203 B2
Dual-pattern optical 3D dimensioning
Tao Xian, Mount Laurel, NJ (US); Chen Feng, Snohomish, WA (US); Paul Poloniewicz, Waxhaw, NC (US); and Scott Bracken, Lynnwood, WA (US)
Assigned to Honeywell International Inc., Charlotte, NC (US)
Filed by Honeywell International Inc., Charlotte, NC (US)
Filed on Aug. 16, 2022, as Appl. No. 17/820,089.
Application 17/820,089 is a continuation of application No. 16/585,832, filed on Sep. 27, 2019, granted, now 11,450,083.
Prior Publication US 2023/0184543 A1, Jun. 15, 2023
Int. Cl. G01B 11/25 (2006.01); G06T 7/246 (2017.01); G06T 7/521 (2017.01)
CPC G01B 11/2531 (2013.01) [G01B 11/2513 (2013.01); G06T 7/246 (2017.01); G06T 7/521 (2017.01); G06V 2201/12 (2022.01)] 20 Claims
OG exemplary drawing
 
10. An apparatus for analyzing a dual-pattern, the apparatus comprising at least one processor and at least one memory, the at least one memory having computer-coded instructions therein, the computer-coded instructions, in execution with the at least one processor, configure the apparatus to:
project a full-field dual-pattern to a full projection field using a single optical element, the full-field dual-pattern comprising a full-field left pattern and a full-field right pattern associated with a baseline offset, wherein the single optical element comprises:
a modulation mask that modulates light received from a source light beam to project the full-field dual-pattern,
a light splitter that produces a first light beam and a second light beam from the source light beam,
a first beam bender that relays the first light beam utilized to generate the full-field left pattern, and
a second beam bender that relays the second light beam utilized to generate the full-field right pattern,
detect the full-field left pattern using a first filter;
detect the full-field right pattern using a second filter; and
dimension an object included in the full projection field based on the detected full-field left pattern, the detected full-field right pattern, and the baseline offset.