US 12,134,833 B2
Plating apparatus and cleaning method of contact member of plating apparatus
Masaya Seki, Tokyo (JP); Masaki Tomita, Tokyo (JP); and Shao Hua Chang, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Appl. No. 17/764,454
Filed by EBARA CORPORATION, Tokyo (JP)
PCT Filed Mar. 17, 2021, PCT No. PCT/JP2021/010779
§ 371(c)(1), (2) Date Mar. 28, 2022,
PCT Pub. No. WO2022/195756, PCT Pub. Date Sep. 22, 2022.
Prior Publication US 2023/0340687 A1, Oct. 26, 2023
Int. Cl. C25D 21/08 (2006.01); C25D 17/00 (2006.01); C25D 17/06 (2006.01); C25D 21/10 (2006.01); C25D 21/12 (2006.01)
CPC C25D 21/08 (2013.01) [C25D 17/005 (2013.01); C25D 17/06 (2013.01); C25D 21/10 (2013.01); C25D 21/12 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A plating apparatus comprising:
a plating tank;
a substrate holder disposed above an anode disposed inside the plating tank, the substrate holder being configured to hold a substrate as a cathode;
a rotation mechanism configured to rotate the substrate holder;
an elevating mechanism configured to raise and lower the substrate holder;
a contact member disposed on the substrate holder, the contact member being in contact with an outer peripheral edge of a lower surface of the substrate to supply electricity to the substrate;
a cleaning device configured to clean the contact member, wherein
the cleaning device includes:
a pivot shaft disposed in an outer region in a radial direction of the substrate holder and extending in a vertical direction;
a first arm connected to the pivot shaft and extending in a horizontal direction;
a second arm extending upward from an end portion on a side opposite to a side connected to the pivot shaft of the first arm; and
a nozzle connected to an upper end of the second arm and including at least one discharge port that is open downward and discharges a cleaning fluid directly to the contact member, and
the cleaning device is configured to clean the contact member by applying the cleaning fluid discharged from the discharge port to the contact member; and
a control module configured to control the rotation mechanism, the elevating mechanism, and the cleaning device, wherein
when performing a contact member cleaning process that cleans the contact member, the control module turns the pivot shaft to move the nozzle that has been below the substrate holder and has moved to the outer region in the radial direction of the substrate holder in plan view to an elevating position that is below the substrate holder and is in an inner region in the radial direction of the substrate holder in plan view, subsequently lowers the substrate holder by the elevating mechanism to locate the contact member below the discharge port, subsequently turns the pivot shaft to move the nozzle to a cleaning position where the discharge port is opposed to the contact member in the inner region, and subsequently discharges the cleaning fluid from the discharge port while rotating the substrate holder by the rotation mechanism.