an adhesive component containing a material exhibiting curability by heat or light and a thermoplastic resin, wherein the thermoplastic resin includes at least one of a phenoxy resin, a polyvinyl formal resin, a polystyrene resin, a polyvinyl butyral resin, a polyamide resin, a xylene resin, a polyurethane resin, and a polyester urethane resin;

a first conductive particle being a dendritic conductive particle; and

a second conductive particle being a conductive particle other than the first conductive particle and the second conductive particle comprising a non-conductive core and a conductive layer provided on the core, wherein the conductive layer comprises at least one selected from the group consisting of gold, nickel, and palladium, and the conductive layer has a thickness of 10 to 400 nm,

wherein a ratio of a volume of the first conductive particle to a volume of the second conductive particle in the first and second adhesive layers is in a range of 1.25 to 12.5,

wherein a content of the first conductive particles in the first and second adhesive layers is 2% by volume or more and 25% by volume or less based on a total volume of the first and second adhesive layers, and

wherein a content of the second conductive particles in the first and second adhesive layers is 2% by volume or more and 20% by volume or less based on a total volume of the first and second adhesive layers.