	US 12,134,719 B2
	Hot-melt adhesive
Ai Takamori, Osaka (JP)
Assigned to Henkel AG & CO. KGaA, Duesseldorf (DE)
Filed by HENKEL AG & CO. KGAA, Duesseldorf (DE)
Filed on Jun. 7, 2021, as Appl. No. 17/340,999.
Application 17/340,999 is a continuation of application No. PCT/JP2019/048077, filed on Dec. 9, 2019.
Claims priority of application No. 2018-233579 (JP), filed on Dec. 13, 2018.
Prior Publication US 2021/0292606 A1, Sep. 23, 2021
Int. Cl. C09J 7/35 (2018.01); C08K 5/01 (2006.01); C08L 23/16 (2006.01); C08L 91/06 (2006.01)

CPC C09J 7/35 (2018.01) [C08K 5/01 (2013.01); C08L 23/16 (2013.01); C08L 91/06 (2013.01); C08L 2205/03 (2013.01); C08L 2314/06 (2013.01); C09J 2301/304 (2020.08); C09J 2423/16 (2013.01); C09J 2491/00 (2013.01)]

3 Claims

1. A hot-melt adhesive consisting of: a single olefin copolymer (A), a tackifying resin (B) a wax (C) and an antioxidant (D), wherein

the single olefin copolymer (A) is a propylene/ethylene copolymer (A1) prepared with a metallocene catalyst and having a melting point of 100 to 140° C. and an ethylene content of 7.0 to 10.0% by weight.