	US 12,134,718 B2
	Potting adhesive and heat dissipation device
Peiai You, Shanghai (CN); Hao Sun, Shanghai (CN); Zhen Zhou, Shanghai (CN); and Minli Jia, Shanghai (CN)
Assigned to DELTA ELECTRONICS (SHANGHAI) CO., LTD., Shanghai (CN)
Filed by DELTA ELECTRONICS (SHANGHAI) CO., LTD., Shanghai (CN)
Filed on May 27, 2021, as Appl. No. 17/331,851.
Claims priority of application No. 202010565591.2 (CN), filed on Jun. 19, 2020.
Prior Publication US 2021/0395583 A1, Dec. 23, 2021
Int. Cl. C09J 183/05 (2006.01); B32B 27/20 (2006.01); C09J 11/04 (2006.01); C09J 11/08 (2006.01); C09J 183/04 (2006.01); C09K 5/14 (2006.01); H01F 27/22 (2006.01); H01F 27/32 (2006.01)

CPC C09J 183/04 (2013.01) [C09J 11/04 (2013.01); C09J 11/08 (2013.01); C09K 5/14 (2013.01); H01F 27/22 (2013.01); H01F 27/327 (2013.01)]

18 Claims

1. A potting adhesive, comprising: a component A and a component B, wherein the component A comprises a first liquid organic adhesive containing dimethyl siloxane, the component B comprises a second liquid organic adhesive containing methyl hydrogen siloxane and silicone oil, at least one of the component A and the component B further comprises ceramic particles which are spherical particles with a particle size of 0.5 mm to 2 mm;

wherein a mass ratio of the first liquid organic adhesive to the second liquid organic adhesive to the ceramic particles in the component A and/or the component B is equal to 1: (0.5 to 1.5): (0.1 to 2).

9. A heat dissipation device, comprising an adhesive potting groove, a transformer provided in the adhesive potting groove, and a filling medium which fills and is consolidated in a gap between the transformer and the adhesive potting groove, wherein the filling medium is the potting adhesive according to claim 1.

10. The heat dissipation device according to claim 9, wherein a thermally conductive ceramic sheet is provided between at least two coils of the transformer.