US 12,134,717 B2
Curable silicone composition and cured product of same, multilayer body and method for producing same, and optical device or optical display
Makoto Yoshitake, Ichihara (JP); Atsushi Sugie, Ichihara (JP); Takuya Ogawa, Ichihara (JP); Michitaka Suto, Ichihara (JP); and Haruhiko Furukawa, Ichihara (JP)
Assigned to DOW TORAY CO., LTD., Tokyo (JP)
Appl. No. 17/285,744
Filed by DOW TORAY CO., LTD., Tokyo (JP)
PCT Filed Oct. 15, 2019, PCT No. PCT/JP2019/040432
§ 371(c)(1), (2) Date Apr. 15, 2021,
PCT Pub. No. WO2020/080350, PCT Pub. Date Apr. 23, 2020.
Claims priority of application No. 2018-196663 (JP), filed on Oct. 18, 2018.
Prior Publication US 2022/0025235 A1, Jan. 27, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C09J 183/04 (2006.01); B32B 7/12 (2006.01); B32B 17/06 (2006.01); B32B 37/12 (2006.01); C09J 5/00 (2006.01); H01L 33/56 (2010.01)
CPC C09J 183/04 (2013.01) [B32B 7/12 (2013.01); B32B 17/06 (2013.01); B32B 37/12 (2013.01); C09J 5/00 (2013.01); H01L 33/56 (2013.01); B32B 2037/1253 (2013.01); B32B 2307/412 (2013.01); B32B 2310/08 (2013.01); B32B 2457/20 (2013.01); C09J 2483/00 (2013.01); H01L 2933/005 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A curable silicone composition, comprising:
(A) an organopolysiloxane having in a molecule at least 2 alkenyl groups each with 2 to 12 carbon atoms, and comprising the following components (a1) and (a2) where component (a2) is different from component (a1);
(a1) a straight chain or branched organopolysiloxane having in one molecule at least 2 alkenyl groups with 2 to 12 carbon atoms, where 3 to 25 mol % of silicon-bonded organic groups are aryl groups, and
(a2) an organopolysiloxane having an alkenyl group, as expressed by average unit formula: (R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d, where R1 independently represents a monovalent hydrocarbon group with 1 to 12 carbon atoms, at least 1 mol % of R1 are alkenyl groups with 2 to 12 carbon atoms, and a, b, c and d satisfy all of the following conditions: (a+b+c+d)=1, 0≤a≤0.8, 0≤b≤0.4, 0≤c≤0.8, 0≤d≤0.6, and 0.2≤(c+d)≤0.8;
(B) an organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule, and comprising the following components (b1) and (b2) where component (b2) is different from component (b1);
(b1) a straight chain organohydrogenpolysiloxane having at least one silicon-bonded hydrogen atom on one or more ends of a molecular chain, and
(b2) an organohydrogenpolysiloxane having 3 or more silicon-bonded hydrogen atoms in one molecule;
(C) a hydrosilylation reaction catalyst; and
(D) an organic compound having two or more alkoxysilyl groups in one molecule;
wherein:
i) the amount of component (a2) is within a range of 0.5 to 10 mass %, and the amount of component (b2) is within a range of 0.001 to 2.0 mass %, each relative to the sum of non-volatile components of the curable silicone composition;
ii) component (B) is present in an amount such that the silicon-bonded hydrogen atoms in component (B) are 0.5 to 2 mol per 1 mol of aliphatic unsaturated carbon-carbon bonds in component (A);
iii) the amount of component (D) is within a range of 0.001 to 5 mass %, the amount of a polyether compound is 0.1 mass % or less, and the amount of a compound having an epoxy group and alkoxysilyl group is 0.1 mass % or less, each relative to the total amount of the curable silicone composition;
iv) 2 to 20 mol % of the silicon-bonded organic groups in component (A) are aryl groups, and 2 to 17.5 mol % of the silicon-bonded organic groups in the curable silicone composition are aryl groups; and
v) at least one of provisos I) or II) is true:
I)
wherein component (a1) is selected from:
(a1-1) ViMe2SiO(SiMe2O)233(SiMePhO)24OSiMe2Vi;
(a1-2) ViMe2SiO(SiMe2O)240(SiMePhO)17OSiMe2Vi; or
(a1-3) ViMe2SiO(SiMe2O)203(SiMePhO)50OSiMe2Vi; and
wherein component (a2) is selected from:
(a2-1) (ViMe2SiO1/2)0.046(Me3SiO1/2)0.394(SiO4/2)0.56; or
(a2-2) Si(OSiMe2Vi)4;
II)
wherein component (b1) is:
(b1-1) HMe2SiO(SiMe2O)24OSiMe2H; and
wherein component (b2) is selected from:
(b2-1) (HMe2SiO1/2)0.63(SiO4/2)0.37; or
(b2-2) (HMe2SiO1/2)0.75(PhSi)3/2)0.25.