US 12,134,697 B2
Curable hot-melt silicone composition, cured material thereof, and laminate containing curable hot-melt silicone composition or cured material thereof
Ryosuke Yamazaki, Ichihara (JP); Kouichi Ozaki, Ichihara (JP); and Toru Imaizumi, Ichihara (JP)
Assigned to DOW TORAY CO., LTD., Tokyo (JP)
Appl. No. 17/788,121
Filed by DOW TORAY CO., LTD., Tokyo (JP)
PCT Filed Dec. 28, 2020, PCT No. PCT/JP2020/049074
§ 371(c)(1), (2) Date Jun. 22, 2022,
PCT Pub. No. WO2021/132710, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 2019-238729 (JP), filed on Dec. 27, 2019.
Prior Publication US 2023/0137947 A1, May 4, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. C08L 83/04 (2006.01); B32B 25/20 (2006.01); C08J 5/18 (2006.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 7/40 (2018.01); C09J 183/04 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01); H01L 23/29 (2006.01)
CPC C08L 83/04 (2013.01) [B32B 25/20 (2013.01); C08J 5/18 (2013.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 7/40 (2018.01); C09J 183/04 (2013.01); B32B 2305/72 (2013.01); B32B 2307/732 (2013.01); B32B 2457/14 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01); C08J 2383/07 (2013.01); C08J 2483/07 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01); C09J 2483/00 (2013.01); H01L 23/293 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A curable silicone composition having hot-melt properties as a whole, comprising:
(A) 100 mass parts of an organopolysiloxane resin containing the following component (A1) and component (A2) at a mass ratio of 0:100 to 90:10;
(A1) an organopolysiloxane resin that is solid at 25° C., having a curing reactive functional group containing a carbon-carbon double bond in a molecule, containing a siloxane unit expressed by SiO4/2 making up at least 20 mol % or more of all siloxane units, and not having hot-melt properties alone;
(A2) an organopolysiloxane resin that is solid at 25° C., not having a curing reactive functional group containing a carbon-carbon double bond in a molecule, containing a siloxane unit expressed by SiO4/2 making up at least 20 mol % or more of all siloxane units, and not having hot-melt properties alone;
(B) 10 to 100 mass parts of a straight-chain or branched-chain organopolysiloxane that is liquid or has plasticity at 25° C., having a curing reactive functional group containing at least two carbon-carbon double bonds in a molecule;
(C) an organohydrogenpolysiloxane expressed by the following average compositional formula (1):
(R43SiO1/2)a(R52SiO2/2)b(R5SiO3/2)c(SiO4/2)d  (1)
where R4 independently represents a hydrogen atom or an unsubstituted or substituted monovalent hydrocarbon group having from 1 to 12 carbon atoms that does not contain an aliphatic unsaturated bond, R5 independently represents an unsubstituted or substituted monovalent hydrocarbon group free from aliphatic unsaturated bonds and with 1 to 12 carbon atoms, at least two of all R4s represent hydrogen atoms, and a, b, c, and d represent numbers that satisfy conditions of 0.01≤a≤0.6, 0≤b, 0≤c≤0.9, 0≤d≤0.9, and (a+b+c+d)=1 and (c+d)≥0.2, and having a mass loss ratio relative to pre-exposure of 10% or less after exposure to 100° C. for 1 hour under atmospheric pressure, at an amount where the number of hydrogen atoms bonded to a silicon atom per alkenyl group bonded to a silicon atom included in the entire curable silicone composition is 0.5 to 20.0; and
(D) a sufficient amount of a hydrosilylation reaction catalyst to crosslink the curable silicone composition.