US 12,134,696 B2
Resin composition, prepreg, resin sheet, laminate, metal foil-clad laminate, and printed wiring board
Takaaki Ogashiwa, Tokyo (JP); Tetsuro Miyahira, Tokyo (JP); Tatsuro Takamura, Tokyo (JP); and Sayaka Ito, Tokyo (JP)
Assigned to MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
Appl. No. 18/276,539
Filed by MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
PCT Filed Jan. 26, 2022, PCT No. PCT/JP2022/002836
§ 371(c)(1), (2) Date Aug. 9, 2023,
PCT Pub. No. WO2022/172752, PCT Pub. Date Aug. 18, 2022.
Claims priority of application No. 2021-020067 (JP), filed on Feb. 10, 2021.
Prior Publication US 2024/0043687 A1, Feb. 8, 2024
Int. Cl. C08L 79/08 (2006.01); C08J 5/18 (2006.01); C08J 5/24 (2006.01); C08K 3/22 (2006.01); C08K 7/18 (2006.01); H05K 1/03 (2006.01)
CPC C08L 79/08 (2013.01) [C08J 5/18 (2013.01); C08J 5/244 (2021.05); C08J 5/249 (2021.05); C08K 3/22 (2013.01); C08K 7/18 (2013.01); H05K 1/0373 (2013.01); C08J 2379/08 (2013.01); C08J 2463/00 (2013.01); C08K 2003/2237 (2013.01); C08K 2201/005 (2013.01); C08L 2203/20 (2013.01); H05K 2201/0209 (2013.01)] 13 Claims
 
1. A resin composition, comprising:
(A) BaTi4O9,
(B) a filler different from the BaTi4O9 (A), and
(C) a thermosetting resin,
wherein a median particle size, D50, of the BaTi4O9 (A) is 0.10 to 1.00 μm,
a median particle size, D50, of the filler (B) is 0.10 to 10.00 μm,
the filler (B) comprises silica,
a volume ratio of the BaTi4O9 (A) to the filler (B), the BaTi4O9 (A): the filler (B), ranges from 15:85 to 80:20, and
the thermosetting resin (C) comprises one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, and an epoxy compound.