US 12,134,274 B2
Molded structures with channels
Chien-Hua Chen, Corvallis, OR (US); Michael W. Cumbie, Corvallis, OR (US); and Michael G. Groh, Corvallis, OR (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed on Aug. 23, 2023, as Appl. No. 18/454,771.
Application 18/454,771 is a continuation of application No. 17/312,360, granted, now 11,780,227, previously published as PCT/US2019/039074, filed on Jun. 25, 2019.
Prior Publication US 2023/0391086 A1, Dec. 7, 2023
Int. Cl. B41J 2/16 (2006.01); B41J 2/14 (2006.01); B41J 2/18 (2006.01)
CPC B41J 2/1639 (2013.01) [B41J 2/14016 (2013.01); B41J 2/14201 (2013.01); B41J 2/1601 (2013.01); B41J 2/1607 (2013.01); B41J 2/1625 (2013.01); B41J 2/18 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A device comprising:
a molded structure comprising:
thermo-electric traces; and
first channels;
a dependent device coupled to the molded structure, the dependent device comprising:
thermo-electric contacts connected to the thermo-electric traces; and
apertures,
wherein a cooling fluid travels through the first channels of the molded structure and into the apertures of the dependent device to extract thermal energy from the dependent device and carry the extracted thermal energy away from the dependent device through the apertures and the first channels, wherein the dependent device further comprises second channels, wherein the second channels are microfluidic channels through which the cooling fluid travels to carry the thermal energy away from the dependent device.