US 12,134,271 B2
Pressure control device and substrate treatment apparatus including the same
Dong Hwa Lee, Anyang-si (KR); Dai Geon Yoon, Anyang-si (KR); Bong Man Choi, Cheonan-si (KR); Jong Suk Won, Seongnam-si (KR); and Hyeong Jun Cho, Seoul (KR)
Assigned to Semes Co., Ltd.
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Mar. 13, 2023, as Appl. No. 18/182,577.
Claims priority of application No. 10-2022-0183963 (KR), filed on Dec. 26, 2022.
Prior Publication US 2024/0208211 A1, Jun. 27, 2024
Int. Cl. B41J 2/045 (2006.01); B41J 2/14 (2006.01)
CPC B41J 2/04583 (2013.01) [B41J 2/14451 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A pressure control device comprising:
an input terminal receiving source air pressure;
an intake valve connected between the input terminal and an output terminal;
an exhaust valve connected to the output terminal;
a pressure sensor connected to the output terminal and generating a sensed value by sensing pressure at the output terminal; and
a controller simultaneously operating the intake valve and the exhaust valve by simultaneously operating a first control loop for adjusting the degree of opening of the intake valve by comparing the sensed value with a first target value and a second control loop for adjusting the degree of opening of the exhaust valve by comparing the sensed value with a second target value.