| CPC B32B 37/1284 (2013.01) [B29C 65/4805 (2013.01); B29C 65/5057 (2013.01); B29C 65/52 (2013.01); B29C 66/721 (2013.01); B29C 66/742 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/20 (2013.01); B29L 2031/082 (2013.01); B32B 2603/00 (2013.01)] | 5 Claims |

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1. A method comprising:
adhesively bonding a first substrate on a second substrate in an adhesive bonding zone between the first and second substrates by means of an adhesive joint integrating a support mesh, the adhesively bonding comprising:
providing the adhesive joint in said adhesive bonding zone between the first and second substrates,
folding over a surplus adhesive joint of the adhesive joint beyond said adhesive bonding zone onto one or the other of the first or second substrates,
curing the adhesive joint, and
eliminating the surplus adhesive joint,
wherein the surplus joint is folded over onto said one or the other of the first or second substrates so that the support mesh is present over an entirety of the adhesive bonding zone after the curing, and
wherein a surface of the first or second substrates that is to receive the surplus adhesive joint is previously prepared to facilitate eliminating said surplus adhesive joint by depositing a peel-off fabric or an adhesive tape made of Teflon on at least a portion of the surface of said first or second substrates.
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