US 12,134,164 B2
Channel cut polishing machine
Elina Kasman, Naperville, IL (US); and Jonathan Montgomery, Naperville, IL (US)
Assigned to UCHICAGO ARGONNE, LLC, Chicago, IL (US)
Filed by UCHICAGO ARGONNE, LLC, Chicago, IL (US)
Filed on Jun. 10, 2020, as Appl. No. 16/897,426.
Application 16/897,426 is a division of application No. 15/721,568, filed on Sep. 29, 2017, granted, now 10,682,738.
Prior Publication US 2020/0368875 A1, Nov. 26, 2020
Int. Cl. B24B 7/02 (2006.01); B24B 1/00 (2006.01); B24B 7/07 (2006.01); B24B 37/013 (2012.01); B24B 37/015 (2012.01); B24B 37/04 (2012.01); B24B 37/10 (2012.01); B24B 37/30 (2012.01); B24B 37/34 (2012.01); B24B 41/00 (2006.01); B24B 41/06 (2012.01); B24B 49/04 (2006.01); B24B 49/12 (2006.01); B24B 51/00 (2006.01)
CPC B24B 51/00 (2013.01) [B24B 1/00 (2013.01); B24B 7/02 (2013.01); B24B 7/075 (2013.01); B24B 37/013 (2013.01); B24B 37/015 (2013.01); B24B 37/04 (2013.01); B24B 37/042 (2013.01); B24B 37/34 (2013.01); B24B 37/345 (2013.01); B24B 41/00 (2013.01); B24B 41/005 (2013.01); B24B 41/068 (2013.01); B24B 49/04 (2013.01); B24B 49/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method of polishing of a workpiece comprising:
placing the workpiece on a tray;
removably mounting the workpiece to the tray using an adhesive;
wherein said tray is attached to a support base and wherein said support base is in turn attached to an alignment and a linear motion stage wherein the alignment and linear motion stage is capable of moving in a horizontal direction;
installing a polishing pad on a polishing tool;
attaching the polishing tool on a rotating shaft;
attaching the rotating shaft to a motor installed on a vertical motion platform;
wherein said vertical motion platform is disposed above the workpiece removably mounted to the tray;
beginning the rotation of the polishing tool;
lowering the polishing tool to the workpiece;
contacting the rotating polishing pad with regions of workpiece surfaces;
moving the linear motion stage and the vertical motion platform to polish the regions of the workpiece;
detecting the surface profile of the workpiece;
ceasing the rotation of the polishing pad upon detection of a smooth surface on the workpiece;
raising of the vertical platform and the polishing tool; and
removing of the workpiece, wherein contact-less measurements are made to determine when polishing is completed.