US 12,134,162 B2
Wafer polishing head, method for manufacturing wafer polishing head, and wafer polishing apparatus comprising same
Jae Chel Sung, Gyeongsangbuk-do (KR)
Assigned to SK SILTRON CO., LTD., Gyeongsangbuk-Do (KR)
Appl. No. 17/765,899
Filed by SK SILTRON CO., LTD., Gyeongsangbuk-do (KR)
PCT Filed Oct. 23, 2019, PCT No. PCT/KR2019/013927
§ 371(c)(1), (2) Date Apr. 27, 2022,
PCT Pub. No. WO2021/066242, PCT Pub. Date Apr. 8, 2021.
Claims priority of application No. 10-2019-0121299 (KR), filed on Oct. 1, 2019.
Prior Publication US 2022/0379429 A1, Dec. 1, 2022
Int. Cl. B24B 37/20 (2012.01)
CPC B24B 37/20 (2013.01) 16 Claims
OG exemplary drawing
 
1. A wafer polishing head, comprising:
a template assembly comprising a base substrate, a guide ring disposed at an edge of the base substrate, an adhesive material configured to adhere the guide ring and the base substrate to each other, a round surface formed on an outer side surface of the guide ring, and an adhesive applied to one surface of the base substrate;
a first coating layer formed on the round surface;
a rubber chuck configured to fix the base substrate and to support the template assembly; and
a second coating layer formed on the adhesive and an outer circumferential surface of the guide ring, wherein the first coating layer has a thickness of 2 mm to 5 mm, and the width of the first coating layer is greater than the width of the rounded portion of the guide ring.