US 12,134,161 B2
Method for polishing diamond crystal, and diamond crystal
Seongwoo Kim, Tokyo (JP); Daiki Fujii, Tokyo (JP); Koki Oyama, Tokyo (JP); and Koji Koyama, Tokyo (JP)
Assigned to Orbray Co., Ltd., Tokyo (JP)
Filed by Orbray Co., Ltd., Tokyo (JP)
Filed on Sep. 10, 2020, as Appl. No. 17/017,220.
Application 17/017,220 is a continuation of application No. PCT/JP2019/010524, filed on Mar. 14, 2019.
Claims priority of application No. 2018-048664 (JP), filed on Mar. 16, 2018.
Prior Publication US 2020/0406420 A1, Dec. 31, 2020
Int. Cl. B24B 37/04 (2012.01)
CPC B24B 37/042 (2013.01) 2 Claims
OG exemplary drawing
 
1. A method for polishing a diamond crystal, the method comprising:
providing a diamond crystal having a main surface having a plane orientation of (100);
performing mechanical polishing on the main surface of the diamond crystal using a polishing wheel such that: a tangent of a contact position on the diamond crystal contacts a curve that extends in a rotation direction in which the polishing wheel is rotating and that contacts the contact position at which the diamond crystal contacts the polishing wheel that is rotating; and a tangent direction of the tangent at the contact position is within a range of ±10 degrees relative to a <110> direction of the diamond crystal, thereby causing an affected region to appear such that the affected region is parallel to a direction of a plane orientation (111) of the diamond crystal and penetrates the diamond crystal onto the main surface; and
performing chemical mechanical polishing on the main surface of the diamond crystal to remove the affected region, thereby removing the affected region from the main surface.