US 12,134,146 B2
Bonding member, method for producing bonding member and method for producing bonding structure
Katsuaki Suganuma, Suita (JP); Chuantong Chen, Suita (JP); Toshiyuki Ishina, Suita (JP); Seungjun Noh, Suita (JP); and Chanyang Choe, Suita (JP)
Assigned to OSAKA UNIVERSITY, Osaka (JP)
Filed by OSAKA UNIVERSITY, Osaka (JP)
Filed on Jul. 13, 2022, as Appl. No. 17/812,352.
Application 17/812,352 is a division of application No. 16/487,924, abandoned, previously published as PCT/JP2018/006721, filed on Feb. 23, 2018.
Claims priority of application No. 2017-032043 (JP), filed on Feb. 23, 2017.
Prior Publication US 2022/0347799 A1, Nov. 3, 2022
Int. Cl. B23K 35/00 (2006.01); B23K 35/30 (2006.01); B32B 15/01 (2006.01); H01L 23/00 (2006.01)
CPC B23K 35/3006 (2013.01) [B32B 15/01 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 2224/271 (2013.01); H01L 2224/278 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/01047 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A method for producing a bonding member used for bonding a first bonding target and a second bonding target together through heating, the bonding member having a surface-processed silver surface, the method comprising:
preparing a silver layer that is porous; and
processing a surface of the silver layer so as to supply the surface of the silver layer with a compressive stress, wherein
the bonding member has a thickness of 50 μm or greater and 300 μm or less.