US 12,134,143 B2
Laser processing machine
Yuji Hadano, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Jan. 5, 2022, as Appl. No. 17/647,073.
Claims priority of application No. 2021-002679 (JP), filed on Jan. 12, 2021.
Prior Publication US 2022/0219263 A1, Jul. 14, 2022
Int. Cl. B23K 26/40 (2014.01); B23K 26/06 (2014.01); B23K 26/0622 (2014.01); B23K 26/073 (2006.01); B23K 26/146 (2014.01); B23K 103/00 (2006.01); H01L 21/67 (2006.01)
CPC B23K 26/40 (2013.01) [B23K 26/0622 (2015.10); B23K 26/0643 (2013.01); B23K 26/0665 (2013.01); B23K 26/0736 (2013.01); B23K 26/146 (2015.10); H01L 21/67092 (2013.01); B23K 2103/56 (2018.08)] 3 Claims
OG exemplary drawing
 
1. A laser processing machine comprising:
a chuck table configured to hold a workpiece;
a laser beam application unit configured to apply a pulsed laser beam to the workpiece held on the chuck table;
an X-axis direction feed mechanism configured to perform relative processing feed of the chuck table and the laser beam application unit in an X-axis direction; and
a Y-axis direction feed mechanism configured to perform relative processing feed of the chuck table and the laser beam application unit in a Y-axis direction that intersects the X-axis direction at right angles,
wherein the laser beam application unit includes
a laser oscillator that oscillates pulsed laser and emits a pulsed laser beam,
a spot shaper configured to shape a spot profile of the pulsed laser beam emitted from the laser oscillator such that the spot profile becomes long in the Y-axis direction and short in the X-axis direction,
a polygon mirror that disperses, in the X-axis direction, the spot which has been shaped by the spot shaper, and
a condenser that focuses, on the workpiece held on the chuck table, the pulsed laser beam which has been dispersed by the polygon mirror so that the spot profile in the Y-axis direction is oriented in a width direction of each of a plurality of intersecting streets formed on the workpiece.