CPC B22F 9/30 (2013.01) [B22F 1/054 (2022.01); B22F 1/0545 (2022.01); B22F 1/056 (2022.01); B22F 9/06 (2013.01); C08K 3/08 (2013.01); C09D 11/52 (2013.01); B22F 2201/03 (2013.01); B22F 2301/10 (2013.01); C08K 2003/085 (2013.01)] | 13 Claims |
1. A method of forming nanoparticles consisting of metallic copper, which method does not require a reducing agent to reduce copper formate, the method comprising the steps of:
a) providing a solution at temperature T0, the solution comprising
i. a copper precursor comprising neat copper formate; the neat copper formate not being coordinated by a complexing agent or ligand other than formate;
ii. a stabilizer comprising at least one amine; and
iii. optionally a solvent;
so as to form nanoparticles consisting of metallic copper,
wherein the concentration of the copper precursor in the solution is at least 0.2 M and the concentration of the stabilizer in the solution is greater than or equal to the concentration of the copper precursor with a molar ratio of copper precursor to stabilizer being between 1:1 and 1:3;
b) heating the solution of step a) to a temperature T1 at which temperature the copper precursor starts to decompose to form metallic copper (Cu0); and
c) heating the solution of step b) to a temperature T2 to form nanoparticles consisting of metallic copper and having a size of at least 4 nm, the temperature T2 being at least 10° C. higher than temperature T1,
wherein the temperature of the solution is increased from temperature T1 to temperature T2 with an average rate of at least 2 degrees per minute.
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