US 12,134,113 B2
Substrate processing apparatus including nozzle unit and substrate processing method
Ju Hwan Lee, Hwaseong-si (KR); Hyeon Jun Lee, Cheonan-si (KR); So Young Park, Cheonan-si (KR); and Myung A Jeon, Yeosu-si (KR)
Assigned to SEMES CO., LTD., Cheonan-si (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Mar. 6, 2023, as Appl. No. 18/117,592.
Claims priority of application No. 10-2022-0118145 (KR), filed on Sep. 19, 2022.
Prior Publication US 2024/0091819 A1, Mar. 21, 2024
Int. Cl. B08B 3/02 (2006.01); B08B 13/00 (2006.01); H01L 21/67 (2006.01)
CPC B08B 3/022 (2013.01) [B08B 13/00 (2013.01); H01L 21/67051 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A substrate processing method for processing a substrate by using a liquid processing apparatus, the substrate processing method comprising:
a first nozzle moving step of moving a first nozzle to a process position and a standby position in a swing motion manner;
a cleaning liquid supplying step of supplying, by the first nozzle, a cleaning liquid onto a rotating substrate at the process position of the first nozzle;
a second nozzle moving step of moving a second nozzle to a process position and a standby position in a swing motion manner;
a drying gas supplying step of supplying, by the second nozzle, a drying gas onto the rotating substrate at the process position of the second nozzle; and
a nozzle distance controlling step of controlling a distance between the first nozzle and the second nozzle on the basis of a horizontal position of at least one of the first nozzle and the second nozzle.