US 12,134,097 B2
Microfluidic chip and fabrication method
Wei Li, Shanghai (CN); Baiquan Lin, Shanghai (CN); Kaidi Zhang, Shanghai (CN); Yunfei Bai, Shanghai (CN); Ping Su, Shanghai (CN); Kerui Xi, Shanghai (CN); and Zhenyu Jia, Shanghai (CN)
Assigned to Shanghai Tianma Micro-Electronics Co., Ltd., Shanghai (CN)
Filed by Shanghai Tianma Micro-Electronics Co., Ltd., Shanghai (CN)
Filed on Mar. 2, 2022, as Appl. No. 17/684,719.
Claims priority of application No. 202111647733.0 (CN), filed on Dec. 30, 2021.
Prior Publication US 2023/0211345 A1, Jul. 6, 2023
Int. Cl. B01L 3/00 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01)
CPC B01L 3/502784 (2013.01) [B81B 3/0089 (2013.01); B81C 1/00714 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/161 (2013.01); B01L 2300/1805 (2013.01); B01L 2400/0415 (2013.01); B81B 2201/057 (2013.01); B81B 2203/0353 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0198 (2013.01); B81C 2201/053 (2013.01)] 19 Claims
OG exemplary drawing
 
7. A microfluidic chip, comprising:
an array substrate;
a hydrophobic layer, disposed on a side of the array substrate, wherein the hydrophobic layer includes at least one through-hole, and a through-hole of the at least one through-hole penetrates through the hydrophobic layer along a direction perpendicular to a plane of the array substrate; and
at least one hydrophilic structure, wherein a hydrophilic structure of the at least one hydrophilic structure is disposed in the through-hole,
wherein the array substrate includes:
a base substrate,
a circuit layer, disposed on a side of the base substrate, wherein the circuit layer includes a plurality of first transistors,
an electrode layer, disposed on a side of the circuit layer away from the base substrate, wherein the electrode layer includes a plurality of driving electrodes, and a driving electrode of the plurality of driving electrodes is electrically connected to a first transistor of the plurality of first transistors, and
an insulating layer, disposed on a side of the electrode layer away from the base substrate, wherein the hydrophobic layer is disposed on a side of the insulating layer away from the base substrate.